Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies

Book Description

Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel.

Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable.

Provides engineers the cutting-edge technology in a rapidly changing field

Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process

Customer Reviews:

The Practical Science of Reflow Soldering.......2002-10-05

Few people have made more contributions to reflow soldering than Dr. Lee has. He has been a driving force in taking surface mount technology (SMT) from an art to a science. This book is a compilation of these successes with ample references to the important work of others. Those who work in this field will find this book indispensable in setting up and optimizing SMT assembly processes. In my opinion Dr. Lee's book is unequal in its value to practitioners in SMT.

Solving your solder-reflow problems!.......2002-04-26

This excellent book on reflow soldering, by noted expert Doctor Ning-Cheng Lee, offers a unique approach that will be invaluable to anyone concerned with practical applications of microelectronics packaging.

Many books, including this one, tell you how reflow soldering should work. Dr. Lee's book goes beyond those basics, to tell you in great detail what most other books do not long dwell upon: what to do when reflow soldering does not work as expected. How to identify the problems. How to cure or compensate for problems to achieve good solder reflow interconnections. How to use the defects themselves to eliminate defects and to optimize your solder reflow process.

The first four chapters are a clear and complete exposition of reflow soldering and of surface mount assembly processes. They cover surface mount technology in general, solders and solder pastes, and the beginning-to-end steps in surface mount assembly. Nourishment for the technical mind ranges from the organic chemistry of fluxes to equations relating surface tension and solder spread. These four chapters provide an excellent summary of how reflow soldering is supposed to work.

The next seven chapters place a strong focus on trouble-shooting. Not on how things go when all is well, but on what things can go wrong, and how to fix, to compensate for, or to work around them when they do go wrong. The logical structure is clear: three chapters on reflow problems, titled "Before Reflow," "During Reflow," and "After Reflow." Three chapters on the special techniques and the potential problems encountered in solder bumping area array packages, in assembling and reworking BGA & CSP packages, and in reflowing solder-bumped flip chips. Each chapter first covers the required materials and processes, and then details all of the potential problems that might be encountered, and how best to solve them.

The capstone chapter describes how to optimize a reflow process through the proper analysis of the defect mechanisms encountered. This chapter requires 39 sub-sections to systematically step through identifying, analyzing, and correcting defects. It turns defect analysis into a powerful tool for optimizing the reflow process. Further discussion extends this optimization approach to other alloys and systems, and suggests that your creativity might carry it still further.

The final chapter is a now-obligatory look at the "lead-free" juggernaut bearing down on the industry, with some recognition that this juggernaut carries its own baggage of potential problems.

Dr. Lee makes good use of the large (7 by 10 inch) format to place multiple graphics on almost every page. At less than one inch thick, this 280-page book can be easily slipped into an ordinary briefcase, and carried without muscle strain. Some current reviews incorrectly state that this book has 384 pages. Apparently they copied another book's page count from the multiple back cover blurbs, instead of opening the book themselves.

Book Description

The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® (The International Series in Engineering and Computer Science)

Average customer rating:

The essential guide for solder reliability analysis with ANSYS

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® (The International Series in Engineering and Computer Science)
Erdogan Madenci , Ibrahim Guven , and Bahattin Kilic
Manufacturer: Springer
ProductGroup: Book
Binding: Hardcover

Industrial & Technical | Chemistry | Science | Subjects | Books

General | Science | Subjects | Books

Applied | Physics | Science | Subjects | Books

General | Medicine | Subjects | Books

General | Computers & Internet | Subjects | Books

General | Arts & Photography | Subjects | Books

All Titles | Qualifying Textbooks - Fall 2007 | Stores | Books

Arts & Photography | Qualifying Textbooks - Fall 2007 | Stores | Books

Computers & Internet | Qualifying Textbooks - Fall 2007 | Stores | Books

Medicine | Qualifying Textbooks - Fall 2007 | Stores | Books

Professional | Qualifying Textbooks - Fall 2007 | Stores | Books

Science | Qualifying Textbooks - Fall 2007 | Stores | Books
Similar Items:

ASIN: 1402073305

Book Description

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.

Customer Reviews:

The essential guide for solder reliability analysis with ANSYS.......2006-09-14

This text is a gem. The included add-on package for ANSYS alone is worth twice the price of this book. The reader is first introduced to the theoretical basis of fatigue life prediction, a rather thorough survey of research done in the electronic packaging field. The chapters that follow explain step by step how a detailed FEA model can be created very efficiently using the provided addon package called ReliANS. Highly recommended for any engineer wanting to exploit ANSYS for more reliable package design, and others who wish to improve on their current methods.

Average customer rating:

Metallurgy of Welding
J. F. Lancaster
Manufacturer: Unwin Hyman
ProductGroup: Book
Binding: Hardcover

Welding | Engineering | Professional & Technical | Subjects | Books
Similar Items:

Welding Metallurgy

ASIN: 0046690085

Solder Joint Reliability: Theory and applications

Average customer rating:

Required reading in understanding solder joint fatigue

Solder Joint Reliability: Theory and applications
John H. Lau
Manufacturer: Springer
ProductGroup: Book
Binding: Hardcover

Welding | Engineering | Professional & Technical | Subjects | Books

General | Science | Subjects | Books

General | Arts & Photography | Subjects | Books

All Titles | Qualifying Textbooks - Fall 2007 | Stores | Books
Accessories:

ASIN: 0442002602

Customer Reviews:

Required reading in understanding solder joint fatigue.......1998-08-08

In depth treatment of solder joint reliability. Excellent text for those attempting to understand the solder joint metalurgy and life calculation.

Detail can be mind-numbing, but all the material includes high level information as well as all the gritty details.

Book Description

no description

Customer Reviews:

Much good information, poorly written.......1999-09-30

There is a great deal of information presented in this book, though organization is a bit loose. The real problem with it, however, is presentation. it is poorly written, apparently unedited, and badly printed.

Book Description

Managers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a photographic guide to defects, and contains many line drawings, tables and flow charts to illustrate the subject of electronics assembly.

Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology.

Mike Judd is MD of Mike Judd Marketing and former MD of Electrovert UK, Director of Marketing Europe for Electrovert, part of the Cookson Group, and Director of OEM at Speedline.

Keith Brindley is a technical author with a wealth of experience of all aspects of electronics technology.

- A practical guide for the industry covering all the main soldering processes currently in use
- Cleaning, faults, troubleshooting and standards are all major topics
- Considers safety and solder process quality assessment

Customer Reviews:

A definitive work on production soldering.......2000-03-27

Soldering in Electronics Assembly contains the broadest base of technology and materials related to all facets of electronic soldering. Our technical quality controls engineer here at The RSS Group has adopted the volume as the training and inspection standard for our assemblers and inspectors.

Book Description

Solder remains the most common interconnecting material for electronic packaging and assembly. Yet, as various technologies have advanced, so too have the manifold uses to which solder is put. This comprehensive volume details all of the most current soldering techniques, along with the fundamental principles involved in each process. And it clearly relates those principles directly to practical applications encountered in today's electronics manufacturing environments. Ideal for material and process troubleshooting, the book also includes solder data tables for quick reference.

Customer Reviews:

It was not done that well.......2002-08-23

Just a short note to inform other readers:
. It is obvious that information from many sources are put together in this book without a careful review; consequently, there are quite a few inconsistent info.
. This book is not well organized.

Book Description

This book covers anything and everything needed to learn the art of electronics soldering. The traditional notion of soldering no longer applies in the quickly changing world of technology. This book will help you acquire the skills needed to solder wires and components, troubleshoot, utilize simple test meters and more. A great tool for the beginner or someone wanting to advance his or her career.

Customer Reviews:

Horribly Mis-titled.......2003-03-18

The title does not reflect the book's subject. Rather than treating its alleged topic, modern soldering, it attempts to be an everything book for technicians.

In soldering, your first indication that you've made a good solder joint is the visual inspection. With a book on this topic, I'd expect at least some pictures of good and bad solder joint examples, and photos of the various types of joints and packages the technician may encounter. But, the few graphics are limited to schematics of audio amplifiers and also to primitive line drawings of a few chip packages.

I definitely do not recommend this book for soldering, and there are excellent books on fundamental electronics that are so much better than what's presented here. The publisher should have limited the book's scope and required a better presentation.

Books:

Books Index

Books Home

Recommended Books